The 2026 IEEE Electronic Components and Technology Conference (ECTC) is gearing up to be a pivotal event for the semiconductor packaging sector. Set to occur from May 26-29, 2026, at the JW Marriott & Ritz-Carlton Grande Lakes Resort in Orlando, Florida, this esteemed conference is anticipated to draw over 2,000 attendees from more than 20 nations, including scientists, engineers, and industry experts.
Abstract submissions for ECTC 2026 will commence on August 18, 2025, with the deadline set for October 6, 2025. Prospective contributors are encouraged to review the detailed guidelines in the ECTC 2026 Call for Papers section and submit their abstracts accordingly.
The technical agenda at ECTC 2026 will encompass a broad spectrum of subjects, emphasizing the latest advancements, trends, and applications in fields such as components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, among others. Highlighted topics include heterogeneous integration, chiplet architectures, hybrid bonding, wafer-level packaging (WLP) and panel-level packaging (PLP), fan-out and fan-in packaging, flip-chip technologies, integrated photonics and optoelectronics, LEDs, 5G, quantum computing, and other emerging technologies in electronics packaging.
Topics for Paper Submission
ECTC 2026 is calling for previously unpublished, non-commercial paper abstracts in a variety of areas, including:
- Applied Reliability
- Assembly and Manufacturing Technology
- Electrical Design and Analysis
- Emerging Technologies
- Interconnections
- RF, High-Speed Components & Systems
- Materials & Processing
- Thermal/Mechanical Simulation & Characterization
- Packaging Technologies
- Photonics
- Interactive Presentations
This conference is poised to be a landmark event for professionals in the field, providing a platform to delve into groundbreaking innovations and connect with industry leaders.